Light Emitting Diode Chip and Fabrication Method
AssigneeXiamen Sanan Optoelectronics Technology Co., Ltd.
InventorsJiansen ZHENG, Su-Hui LIN, Chen-Ke HSU, Chih-Wei CHAO
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AssigneeXiamen Sanan Optoelectronics Technology Co., Ltd.
InventorsJiansen ZHENG, Su-Hui LIN, Chen-Ke HSU, Chih-Wei CHAO
Estimating the term…
A light-emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions; and a light transmission layer having a plurality of light transmission portions between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission portions have a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serve as current blocking layer. A current spreading layer covers the light transmission layer and the epitaxial layer not masked by the light transmission layer. A refractive index of the light transmission layer is between those of the epitaxial layer and the holes, indicating a difference of refractive index between the light transmission layer and the epitaxial layer. Light scattering probability can therefore be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency.
A method of fabricating a light-emitting diode (LED) chip, the method comprising:
A method of fabricating a light-emitting diode (LED) chip, the method comprising:
Dependencies are inferred from the claim text.