Optoelectronic Semiconductor Chip and Method for Producing Optoelectronic Semiconductor Chips

An optoelectronic semiconductor chip, comprising:

• a semiconductor body having an active region, a first semiconductor layer of a first conduction type, and a second semiconductor layer of a second conduction type, which differs from the first conduction type, the active region being arranged between the first semiconductor layer and the second semiconductor layer;
• a carrier, on which the semiconductor body is arranged;
• a first connection layer, which is arranged between the carrier and the semiconductor body;
• and
• an encapsulation layer arranged between the first connection layer and the carrier, wherein the encapsulation layer is metallic.

A method, comprising:

• providing a semiconductor layer sequence on a substrate, wherein the semiconductor layer sequence has an active region arranged between a first semiconductor layer of a first conduction type and a second semiconductor layer of a second conduction type, which differs from the first conduction type;
• forming a first connection layer on the semiconductor layer sequence;
• forming an encapsulation layer on the first connection layer;
• forming a composite assembly comprising the semiconductor layer sequence and a carrier;
• forming a plurality of semiconductor bodies from the semiconductor layer sequence, wherein the encapsulation layer is exposed in regions;
• and
• singulating the composite assembly into a plurality of semiconductor chips.