Semiconductor device and method of manufacturing same
AssigneeRenesas Electronics Corporation
InventorAtsushi AMO
Life of this patent
Estimating the term…
Abstract
An object is to provide a reliability-improved semiconductor device having a MONOS memory that rewrites data by injecting carriers into a charge storage portion. When a memory gate electrode having a small gate length is formed in order to overlap a carrier injection position in write operation with that in erase operation, each into an ONO film including a charge storage portion, the ONO film is formed in a recess of a main surface of a semiconductor substrate for securing a large channel length. In a step of manufacturing this structure, control gate electrodes are formed by stepwise processing of a polysilicon film by first and second etching and then, the recess is formed in the main surface of the semiconductor substrate on one side of the control gate electrode by second etching.
Claims5
1-12. (canceled)
A semiconductor device, comprising:
- a semiconductor substrate having a first region and a second region arranged along a main surface thereof;
- a control gate electrode formed over the semiconductor substrate via a first insulating film;
- a second insulating film having therein a charge retention portion and a memory gate electrode formed successively over the main surface of the semiconductor substrate in a region adjacent to one of side walls of the control gate electrode;
- and
- a source region and a drain region formed in the main surface of the semiconductor substrate so as to sandwich therebetween the control gate electrode and the memory gate electrode,
- wherein the memory gate electrode is adjacent to the control gate electrode via the second insulating film,
- wherein the control gate electrode, the memory gate electrode, the source region, and the drain region configure memory cells of a nonvolatile memory,
- wherein the memory cells are formed in the first region and the second region, respectively, and
- wherein a bottom surface of the second insulating film in the first region is positioned below a bottom surface of the first insulating film and a bottom surface of the second insulating film in the second region.
Dependencies are inferred from the claim text.