Semiconductor device and method for manufacturing the same
AssigneeVanguard International Semiconductor Corporation
InventorsChu-Feng CHEN, Wei-Chun CHOU, Chien-Wei CHIU
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AssigneeVanguard International Semiconductor Corporation
InventorsChu-Feng CHEN, Wei-Chun CHOU, Chien-Wei CHIU
Estimating the term…
A semiconductor device is provided. The semiconductor device includes a substrate; an epitaxial layer; a first conductive type first well region disposed in the substrate and the epitaxial layer; a second conductive type first buried layer and a second conductive type second buried layer disposed at opposite sides of the first conductive type first well region, respectively; a first conductive type second well region disposed in the epitaxial layer and being in direct contact with the first conductive type first well region; a second conductive type third buried layer disposed in the first conductive type first well region and/or the first conductive type second well region; a second conductive type doped region disposed in the first conductive type second well region; a gate structure; a drain contact plug; and a source contact plug.
A semiconductor device, comprising:
11-20. (canceled)
Dependencies are inferred from the claim text.