Solid-state image pickup device and manufacturing method thereof

A solid-state image pickup device, comprising:

• a functional region provided with an organic photoelectric conversion film over a light incident surface of a semiconductor substrate;
• a plurality of bonding pads disposed in a peripheral region around the functional region;
• a plurality of guard rings surrounding the plurality of bonding pads, wherein the guard rings are connected to the semiconductor substrate;
• and
• a plurality of apertures facing the bonding pads,
• wherein the plurality of guard rings includes a first guard ring that is disposed outside of the plurality of bonding pads and surrounds the plurality of bonding pads in a plan view and second guard rings that surround the plurality of bonding pads respectively in the plan view.

An electronic apparatus, comprising:

• a solid-state image pickup device, including:
• a functional region provided with an organic photoelectric conversion film over a light incident surface of a semiconductor substrate;
• plurality of bonding pads disposed in a peripheral region around the functional region;
• a plurality of guard rings surrounding the plurality of bonding pads, wherein the guard rings are connected to the semiconductor substrate;
• and
• a plurality of apertures facing the bonding pad,
• wherein the plurality of guard rings includes a first guard ring that is disposed outside of the plurality of bonding pads and surrounds the plurality of bonding pads in a plan view and second guard rings that surround the plurality of bonding pads respectively in the plan view.