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US 2017/0323926 A1Published application
Interface substrate and method of making the same
AssigneeQUALCOMM Incorporated
InventorsJon Gregory ADAY, Hong Bok WE, Steve Joseph BEZUK, Nicholas Ian BUCHAN
Life of this patent
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Abstract
A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
Claims28
A package comprising:
- a semiconductor die with a perimeter and a width;
- a substrate with sidewalls, the substrate located vertically below the semiconductor die within the perimeter;
- a mold compound with a width configured to encapsulate the substrate, the mold compound width is approximately the same as the semiconductor die width;
- a first plurality of pads on a first side of the substrate;
- a second plurality of pads on a second side of the substrate;
- a plurality of interconnects that extend from the first plurality of pads to the second plurality of pads;
- and
- a redistribution layer embedded in the substrate proximate the second side of the substrate.
5 more elements
A sensor package, comprising:
- a sensor configured to receive an input and transmit an output;
- a thin film transistor connected to the sensor;
- a piezoelectric layer on a first side of the thin film transistor opposite the sensor;
- a first metal layer configured to encapsulate the piezoelectric layer;
- a first mold compound configured to encapsulate the first metal layer;
- a second metal layer proximate to the first metal layer;
- a conductive layer proximate to the second metal layer;
- a substrate connected to the conductive layer opposite the second metal layer;
- and
- an external connection coupled to the substrate opposite the conductive layer.
7 more elements
A method for forming a package, comprising:
- forming a plurality of substrates, each of the plurality of substrates has a first width;
- forming a plurality of semiconductor dies on a wafer, each of the plurality of semiconductor dies has a second width larger than the first width;
- placing the plurality of substrates on the plurality of semiconductor dies;
- attaching each of the plurality of substrates to a corresponding one of the plurality of semiconductor dies;
- applying a mold compound to the wafer, the mold compound configured to encapsulate the plurality of substrates;
- and
- singulating the wafer to form a plurality of packages, each of the plurality of packages comprises one of the plurality of substrates and one of the plurality of semiconductor dies and each of the plurality of packages has a third width approximately equal to the second width.
4 more elements
Dependencies are inferred from the claim text.