Semiconductor apparatus, solid-state image pickup device, image pickup apparatus, and electronic apparatus

A solid-state image pickup device, comprising:

• a cover glass that is bonded on a pixel with a transparent heat-resistant resin and cut into pieces to protect the pixel before a semiconductor image pickup device is cut into pieces from a wafer state;
• a semiconductor device mounted to be adjacent to the semiconductor image pickup device;
• and
• an underfill resin that is filled in a gap between the cover glass and the semiconductor device and in a periphery of the cover glass and the semiconductor device.

An image pickup apparatus, comprising:

• a cover glass that is bonded on a pixel with a transparent heat-resistant resin and cut into pieces to protect the pixel before a semiconductor image pickup device is cut into pieces from a wafer state;
• a semiconductor device mounted to be adjacent to the semiconductor image pickup device;
• and
• an underfill resin that is filled in a gap between the cover glass and the semiconductor device and in a periphery of the cover glass and the semiconductor device.

An electronic apparatus, comprising:

• a cover glass that is bonded on a pixel with a transparent heat-resistant resin and cut into pieces to protect the pixel before a semiconductor image pickup device is cut into pieces from a wafer state;
• a semiconductor device mounted to be adjacent to the semiconductor image pickup device;
• and
• an underfill resin that is filled in a gap between the cover glass and the semiconductor device and in a periphery of the cover glass and the semiconductor device.