Semiconductor device and method of manufacturing the same, semiconductor module, and electronic device

A method of manufacturing a semiconductor device comprising:

• a process of cutting out a wafer in a strip shape on which a plurality of linear image sensors on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction is formed from a wafer on which a circuit is formed;
• a process of fixing the wafer in the strip shape on a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side;
• and
• a process of cutting out the pedestal on which the wafer in the strip shape is fixed for each linear image sensor to make a chip.

A semiconductor module comprising:

• a semiconductor device;
• an optical lens system;
• and a signal processing unit, wherein
• the semiconductor device includes
• a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side, and
• a linear image sensor on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction, the linear image sensor fixed on the curved surface on which a light-receiving area formed of the plurality of pixels is curved so as to be concave to the light incident side.