Integrated circuit assembly that includes stacked dice
AssigneeIntel Corporation
InventorsOmkar Karhade, Nitin Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita
Life of this patent
Estimating the term…
Abstract
An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.
Claims21
(canceled)
An integrated circuit assembly, comprising:
- a substrate;
- a member on the substrate;
- a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member;
- an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member;
- and
- a second die mounted to the first die and the member, wherein the first die is below an upper surface of the member.
An integrated circuit assembly, comprising:
- a substrate;
- a member formed on the substrate;
- a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein an upper surface of first die does is coplanar upper surface of the member;
- an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member;
- and
- a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening, wherein an upper surface of the second die is wire bonded to an upper surface of the member.
An integrated circuit assembly, comprising:
- a substrate with a die side;
- a first die including four edges, a first-die active surface, and a first-die backside surface, wherein the first-die active surface is mounted to the substrate die side;
- an underfill between the first die and the substrate;
- a second die including a second-die active surface and a second-die backside surface, wherein the second-die active surface is mounted to the first die backside surface,
- wherein the second die overhangs the first die on all four edges, wherein an upper surface of the second die is wire bonded to an upper surface of the member, wherein the first die is below an upper surface of the member;
- and
- a mold that forms an opening onto the substrate in which the first die is mounted.
Dependencies are inferred from the claim text.