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US 2017/0323868 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsJoon Young Park, Jung Soo Park, Ji Hye Yoon
Life of this patent
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Abstract
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.
Claims20
An electronic device comprising:
- a substrate comprising a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;
- a semiconductor die comprising a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the bottom die side is coupled to the top substrate side;
- a first conductive interconnection structure between the semiconductor die and the substrate and electrically connecting the semiconductor die to the substrate;
- an adhesive layer comprising a top adhesive layer side, a bottom adhesive layer side, and lateral adhesive layer sides between the top and bottom adhesive layer sides, wherein the bottom adhesive layer side is adhered to the top die side;
- an upper semiconductor package comprising a top upper package side, a bottom upper package side, and lateral upper package sides between the top and bottom upper package sides, wherein the bottom upper package side is adhered to the top adhesive layer side, and wherein the upper semiconductor package comprises:
- an upper package substrate;
- and
- an upper package semiconductor die coupled to a top side of the upper package substrate;
- a first encapsulating material that covers at least the top substrate side and the lateral upper package sides, lateral sides of the upper package substrate, a bottom side of the upper package substrate, the lateral die sides, and the lateral adhesive sides, wherein a top surface of the first encapsulating material is higher than a top side of the upper package semiconductor die;
- and
- an upper package encapsulating material that covers a top side of the upper package semiconductor die.
8 more elements
An electronic device comprising:
- a substrate comprising a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;
- a semiconductor die comprising a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the bottom die side is coupled to the top substrate side;
- a first conductive interconnection structure between the semiconductor die and the substrate, and electrically connecting the semiconductor die to the substrate;
- an adhesive layer comprising a top adhesive layer side, a bottom adhesive layer side, and lateral adhesive layer sides between the top and bottom adhesive layer sides, wherein the bottom adhesive layer side is adhered to the top die side;
- an upper semiconductor package comprising a top upper package side, a bottom upper package side, and lateral upper package sides between the top and bottom upper package sides, wherein the bottom upper package side is adhered to the top adhesive layer side;
- and
- a conductive pillar on the top substrate side and that is electrically connected to the upper semiconductor package, wherein the conductive pillar comprises a column-shaped continuous metal layer that comprises:
- a top column side that is lower, relative to the top substrate side, than the top die side;
- a bottom column side that is lower, relative to the top substrate side, than the bottom die side;
- and
- a lateral column side that extends between the top column side and the bottom column side.
8 more elements
An electronic device comprising:
- a substrate comprising a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;
- a semiconductor die comprising a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the bottom die side is coupled to the top substrate side;
- a first conductive interconnection structure between the semiconductor die and the substrate and electrically connecting the semiconductor die to the substrate;
- an adhesive layer comprising a top adhesive layer side, a bottom adhesive layer side, and lateral adhesive layer sides between the top and bottom adhesive layer sides, wherein the bottom adhesive layer side is adhered to the top die side;
- an upper semiconductor package comprising a top upper package side, a bottom upper package side, and lateral upper package sides between the top and bottom upper package sides, wherein the bottom upper package side is adhered to the top adhesive layer side;
- and
- a first encapsulating material that covers the top substrate side, the lateral die sides, and the lateral adhesive layer sides,
- wherein the first encapsulating material covers a portion of the bottom adhesive layer side.
5 more elements
Dependencies are inferred from the claim text.