Electronic circuit component

An electronic circuit component comprising:

• an electronic component;
• a leadframe that forms a circuit pattern corresponding to an arrangement of the electronic component;
• a resin element in which a part of the leadframe is disposed by insert molding;
• a first lid element that covers a first surface of the resin element on which the electronic component is arranged, wherein the first surface of the resin element includes a concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on a bottom surface of the land, wherein:
• the plurality of terminal portions is a part of the leadframe and is electrically connected to the electronic component;
• a part of the first lid element that is opposed to the land includes a recess that defines a clearance between the electronic component and the first lid element;
• and
• the recess is formed based on an estimated deformation amount of the first lid element, which is estimated through advance calculation of influence of overmolding of the electronic circuit component.

An electronic circuit component comprising:

• an electronic component;
• a leadframe that forms a circuit pattern corresponding to an arrangement of the electronic component;
• a resin element in which a part of the leadframe is disposed by insert molding;
• a first lid element that covers a first surface of the resin element on which the electronic component is arranged, wherein the first surface of the resin element includes a concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on a bottom surface of the land, wherein:
• the plurality of terminal portions is a part of the leadframe and is electrically connected to the electronic component;
• and
• a part of the first lid element that is opposed to the land includes a recess that defines a clearance between the electronic component and the first lid element, the electronic circuit component further comprising an overmold element that covers the resin element and the first lid element, wherein the recess defines the clearance between the electronic component and the first lid element with the overmold element arranged.

An electronic circuit component comprising:

• an electronic component;
• a leadframe that forms a circuit pattern corresponding to an arrangement of the electronic component;
• a resin element in which a part of the leadframe is disposed by insert molding;
• a first lid element that covers a first surface of the resin element on which the electronic component is arranged, wherein the first surface of the resin element includes a concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on a bottom surface of the land, wherein:
• the plurality of terminal portions is a part of the leadframe and is electrically connected to the electronic component;
• and
• a part of the first lid element that is opposed to the land includes a recess that defines a clearance between the electronic component and the first lid element, the electronic circuit component further comprising:
• a second lid element that is disposed on a second surface of the resin element on an opposite side of the resin element from the first surface, wherein the second surface of the resin element includes the concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on the bottom surface of the land of the second surface, wherein:
• the plurality of terminal portions for the second surface is a part of the leadframe and is electrically connected to the electronic component;
• a part of the second lid element that is opposed to the land of the second surface includes a second recess that defines a clearance between the electronic component and the second lid element;
• and
• the second recess is formed based on an estimated deformation amount of the second lid element, which is estimated through advance calculation of influence of overmolding of the electronic circuit component.

An electronic circuit component comprising:

• an electronic component;
• a leadframe that forms a circuit pattern corresponding to an arrangement of the electronic component;
• a resin element in which a part of the leadframe is disposed by insert molding;
• a first lid element that covers a first surface of the resin element on which the electronic component is arranged, wherein the first surface of the resin element includes a concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on a bottom surface of the land, wherein:
• the plurality of terminal portions is a part of the leadframe and is electrically connected to the electronic component;
• and
• a part of the first lid element that is opposed to the land includes a recess that defines a clearance between the electronic component and the first lid element, the electronic circuit component further comprising:
• a second lid element that is disposed on a second surface of the resin element on an opposite side of the resin element from the first surface, wherein the second surface of the resin element includes the concave land in which the electronic component is arranged;
• and
• a plurality of terminal portions that is arranged on the bottom surface of the land of the second surface, wherein:
• the plurality of terminal portions for the second surface is a part of the leadframe and is electrically connected to the electronic component;
• and
• a part of the second lid element that is opposed to the land of the second surface includes a second recess that defines a clearance between the electronic component and the second lid element, the electronic circuit component further comprising an overmold element that covers the resin element, the first lid element, and the second lid element, wherein the recess and the second recess define clearances between the electronic component and the first lid element and between the electronic component and the second lid element in a state where the overmold element covering the resin element, the first lid element, and the second lid element is arranged.