Method for suppressing material warpage by means of pressure difference

A method for suppressing material warpage by means of a pressure difference, comprising the following steps:

• (a) preparing a plurality of carrier boards, each carrier board having a first surface and a second surface that are opposite to each other;
• (b) preparing a plurality of carrier board pressing devices, the carrier board pressing devices being parallelly disposed on an inner side of a processing frame, the carrier board pressing device comprising at least one air inlet, at least one air outlet, at least one air bag, and at least one air passage, the at least one air inlet being connected to a pneumatic supply, the carrier board pressing devices having an upper surface and a lower surface that are opposite to each other, the lower surface being provided with the at least one air bag, the upper surface being provided with the at least one carrier board corresponding to the at least one air bag, one end of the at least one air passage being combined with the at least one air inlet and the at least one air outlet, and the other end being combined with the at least one air bag, and the air bag and the air passage being in communication and forming a confined space;
• (c) adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure;
• (d) filling air into the air bags by using the pneumatic supply, such that air flows into the air bags through the air passages, the air bags are filled with air till a first predetermined pressure is reached, and the exterior of the air bags is pressed against the first surfaces of the carrier boards, by using a pressure difference between the first predetermined pressure in each air bag and the working pressure of the processing chamber, the thermal stresses of the carrier boards caused by material thermal expansion are overcome, to suppress warpage of the carrier boards, wherein the first predetermined pressure in the air bags is greater than the working pressure of the processing chamber, and the pressure difference is greater than 0.01 atm.