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US 2017/0323855 A1Published application
Laser scribe structures for a wafer
AssigneeGlobalfoundries Inc.
InventorsAnthony K. Stamper, Edward C. Cooney, III, Laurie M. Krywanczyk
Life of this patent
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Abstract
Structures that include an identification marking and fabrication methods for such structures. A chip is formed within a usable area of a wafer, and a marking region is formed on the wafer. The marking region is comprised of a conductor used to form a last metal layer of an interconnect structure for the chip. The identification marking is formed in the conductor of the marking region. After the identification marking is formed, a dielectric layer is deposited on the marking region. The dielectric layer on the marking region is planarized.
Claims12
A structure comprising:
- a wafer including a usable area, a wiring region, and a chip within the usable area;
- a marking region on the wafer;
- an identification marking in the marking region;
- and
- a dielectric layer on the marking region and the wiring region, the dielectric layer having a planarized top surface.
2 more elements
Dependencies are inferred from the claim text.