Adapter panel and manufacturing method and encapsulation structure thereof and bonding method for the adapter panel

A manufacturing method for an adapter panel, wherein the method comprises:

• perforating a panel body of an adapter panel to form conical blind hole within the panel body;
• filling the conical blind hole with conical electrical conductor;
• carrying out wiring to the panel body from the side of plane end of the conical electrical conductor;
• thinning the panel body from the side of tip end of the conical electrical conductor until the conical electrical conductor is exposed;
• and
• further thinning the panel body from the side of the tip end of the conical electrical conductor, such that the tip end of the conical electrical conductor protrudes from the panel body and wherein the tip end is inserted into a solder ball to electrically connect with a medium plate.

A bonding method for an adapter panel wherein the adapter panel comprises:

• a panel body having a first surface and a second surface which are opposite each other, wherein a through-hole in a frustum shape is formed through the panel body and between the first surface and the second surface;
• a conical electrical conductor which is filled in the through-hole in a frustum shape, the conical electrical conductor having a plane end and a tip end, wherein the plane end is flush with the first surface and the tip end protruding from the second surface is inserted into a solder ball which is used to electrically connect with a medium plate;
• and
• a wiring structure which is arranged on the first surface of the panel body and is electrically connected to the plane end of the conical electrical conductor;
• the method comprising:
• bonding the protruding tip end of the adapter panel to a medium plate using solder ball, such that the adapter panel is electrically connected to the medium plate.