Electronic power device with flat electronic interconnection structure

A method of making an electronic power device comprising at least implementation of the following steps:

• make several lateral and/or semi-lateral electronic power components in at least one active layer comprising at least one semiconductor such that all electrodes of the electronic power components are located on a front face of the active layer;
• attachment of the front face of the active layer to an electrical interconnection structure comprising several electrically conducting portions to which the electrodes of the electronic power components are electrically connected, and of which at least first parts located in contact with the electrodes of the electronic power components extend in a plane approximately parallel to the active layer;
• attachment of the active layer and the electrical interconnection structure to a front face of a support on which electrically conducting tracks extend, such that:
• the electrical interconnection structure is located between the active layer and the support, the first parts of the electrically conducting portions being placed in contact with the electrically conducting tracks, or
• the active layer is located between the electrical interconnection structure and the support, the electrically conducting portions comprising second parts extending next to the active layer and electrically connecting the first parts of the electrically conducting portions to the electrically conducting tracks.