Strain-Tolerant Die Attach with Improved Thermal Conductivity, and Method of Fabrication

A method for fabricating mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for said die, comprising:

• providing a semiconductor die;
• providing a package for said die;
• fabricating a surface area-enhancing pattern on at least one of said package and said die;
• attaching said die to said package through an interface by introducing die attach materials between said die and said package;
• thereby:
• providing a greater effective bonding area between said die attach materials and said at least one of said package and said die with said pattern than without said pattern;
• and
• simultaneously increasing the surface area for thermal transport between said at least one of said package and said die, and said die attach materials;
• and increasing the surface area for stably attaching said at least one of said package and said die to said die attach materials.

A mechanically-stable and thermally-conductive interface device between a printed circuit board, and either a die package or a heat sink, comprising:

• a printed circuit board;
• either a die package or heat sink;
• a surface area-enhancing pattern on at least one of said printed circuit board, and said die package or heat sink;
• and
• attach materials between said printed circuit board and said die package or heat sink, said attach materials attaching said printed circuit board to said die package or heat sink through an interface provided by said attach materials;
• wherein:
• an effective bonding area between said attach materials and said least one of said printed circuit board and said die package or heat sink, is greater with said pattern than without said pattern;
• and
• said increase of said effective bonding area simultaneously increases the surface area for thermal transport between said least one of said printed circuit board and said die package or heat sink, and said attach materials;
• and increases the surface area for stably attaching said least one of said printed circuit board and said die package or heat sink, to said attach materials.