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US 2017/0323843 A1Published application
Gas-Cooled 3D IC with Wireless Interconnects
AssigneeRochester Institute of Technology
InventorsAmlan Ganguly, Satish G. Kandlikar
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Abstract
A three-dimensional integrated circuit includes two or more stacks of one or more active layers; a gas-cooling layer separating the two or more stacks and a wireless interconnect between the two or more stacks enabling communication between the two or more stacks and system including a gas-cooled three-dimensional integrated circuit having wireless data interconnects is disclosed.
Claims20
A three-dimensional integrated circuit, comprising:
- two or more stacks of one or more active layers;
- a gas-cooling layer separating the two or more stacks and
- a wireless interconnect between the two or more stacks enabling communication between the two or more stacks.
A system comprising:
- a gas-cooled three-dimensional integrated circuit comprising internal wireless data interconnects;
- a gas source in fluid communication with the gas-cooled three-dimensional integrated circuit;
- a link to external data connected to the gas-cooled three-dimensional integrated circuit;
- and
- a power source in communication with the gas-cooled three-dimensional integrated circuit, and optionally a clock signal linked to the gas-cooled three-dimensional integrated circuit.
2 more elements
Dependencies are inferred from the claim text.