US 2017/0323841 A1 · ELECTRONIC DEVICE PROVIDED WITH AN INTEGRAL CONDUCTIVE WIRE AND METHOD OF MANUFACTURE

Abstract

An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

Claims12

Dependent claims

A method, comprising:

producing a hole that extends into a primary encapsulation block which encapsulates a primary electronic device including a supporting substrate and an integrated circuit chip mounted on a front mounting face of the supporting substrate, said hole at least partly uncovering an electrical contact;
installing at least one electrically conductive wire above the primary encapsulation block and in a position such that one end of the electrically conductive wire is electrically connected to said electrical contact;
and
producing an additional encapsulation block on said primary encapsulation block, the additional encapsulation block embedding the electrically conductive wire.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/659,078Filed 25 Jul 2017

Priority

FR 155925130 Sep 2015

Published

9 Nov 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification23 codes

H10W 74/114
The semiconductor body being completely enclosed: by a substrate and the encapsulations
H10P 95/00
Generic processes or apparatus for manufacture or treatments not covered by the
H10W 20/056
Of conductive parts of the interconnections: by filling conductive material into holes, grooves or trenches
H10W 20/081
Of dielectric parts thereof: by forming openings in the dielectric parts

Electronic device provided with an integral conductive wire and method of manufacture

Life of this patent

Electronic device provided with an integral conductive wire and method of manufacture

Life of this patent

Abstract

Claims12