Molded package

A molded package comprising:

• a metal lead frame having a first surface and a second surface opposite to the first surface;
• an IC chip mounted on the first surface of the lead frame;
• and
• a molded resin encapsulating the first surface and the second surface of the lead frame and the IC chip, wherein
• the second surface of the lead frame includes a chip correspondence portion at a position corresponding to the IC chip on the first surface of the lead frame,
• the molded resin has a second surface-side opening portion on the second surface of the lead frame to expose the chip correspondence portion from the molded resin,
• a filler material is filled in the second surface-side opening potion so that the filler material is directly in contact with the chip correspondence portion and seals the second surface-side opening portion, the filler material having a thermal conductivity equal to or greater than that of the molded resin, and being softer than the molded resin,
• the chip correspondence portion has a surface shape that increases a contact area with the filler material relative to a portion of the second surface of the lead frame other than the chip correspondence portion, and
• the filler material is configured to allow the molded package to be in contact with an external member located outside of the molded package at the filler material.