Electronic circuit module

An electronic circuit module comprising:

• a circuit board having a first principal surface on which a first electrode is provided, a second principal surface on which a second electrode including a ground electrode is provided, and a side surface connecting the first principal surface and the second principal surface, and including, as an inner conductor, a pattern conductor and at least one via conductor;
• an electronic component connected to the first electrode;
• an embedding layer provided on the first principal surface of the circuit board and embedding the electronic component;
• and
• a conductive film connected to a conduction path extending the ground electrode,
• wherein the side surface of the circuit board includes a first region connected to the first principal surface, a second region connected to the second principal surface and having a longer circumferential length than the first region, and a connection region connected to the first region and the second region,
• the conduction path extending to the ground electrode includes the via conductor,
• the conductive film is provided on a region including at least a part of each of an outer surface of the embedding layer, the first region, and the connection region, and
• the conductive film provided on at least the part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path extending to the ground electrode.