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US 2017/0323837 A1Published application
Air cavity package
AssigneeMaterion Corporation
InventorsRichard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
Life of this patent
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Abstract
An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
Claims20
An air cavity package adapted to contain a die, comprising:
- a flange having an upper surface;
- and
- a dielectric frame having an upper surface and a lower surface, the lower surface being attached to the upper surface of the flange;
- wherein the dielectric frame is made of an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic.
1 more element
A method for forming an air cavity package, comprising:
- joining a lower surface of a dielectric frame to an upper surface of a flange using a first adhesive composition;
- joining a first conductive lead and a second lead to an upper surface of the dielectric frame using a second adhesive composition;
- and
- curing the first adhesive composition and the second adhesive composition, either separately or simultaneously;
- wherein the dielectric frame comprises an alumina ceramic or a polyimide.
2 more elements
An air cavity package adapted to contain a die, comprising:
- a flange having an upper surface;
- and
- a dielectric frame having an upper surface and a lower surface,
- wherein the lower surface is attached to the upper surface of the flange via a high temperature silicone adhesive.
1 more element
An air cavity package adapted to contain a die, comprising:
- a flange having an upper surface;
- a dielectric frame having an upper surface and a lower surface, the lower surface being attached to the upper surface of the flange;
- and
- a first conductive lead and a second conductive lead, attached to opposite sides of the upper surface of the dielectric frame and each being attached to the upper surface of the dielectric frame by a high temperature silicone adhesive.
1 more element
Dependencies are inferred from the claim text.