Integrated circuit package having i-shaped interconnect

A method of fabricating an integrated circuit packaging, comprising the steps of:

• establishing a base;
• developing a plurality of electrical circuits using a first patterned conductive layer on the base, wherein an electrical circuit is formed by using a masking material;
• and
• developing a stud conductive layer, where the stud conductive layer is disposed on at least one side of the first patterned conductive layer by developing a second layer photo-resist material on the masking material, in which the second layer photo-resist material includes a first line layer with a smaller exposed area than the surface of the conductive layer disposed on one side of the first patterned conductive layer and second line layer with a larger exposed area than the first line layer disposed on the first layer, such that the exposed area forms an “I” shaped connection of the conductive layer and the stud conductive layer.