Microfeature workpieces and methods for forming interconnects in microfeature workpieces
AssigneeMicron Technology, Inc.
InventorsWilliam M. Hiatt, Ross S. Dando
Life of this patent
Estimating the term…
Abstract
Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate.
Claims24
A microfeature workpiece, comprising:
- a substrate having a first side and a second side opposite the first side;
- a microelectronic die formed in and/or on the substrate, the die including a terminal at the first side of the substrate and an integrated circuit operably coupled to the terminal;
- and
- an electrically conductive interconnect extending from the terminal through the substrate and projecting from the second side of the substrate, wherein the interconnect is electrically coupled to the terminal and has an exposed conductive surface at the end of the interconnect;
- a dielectric structure covering the second side of the substrate and having an exterior surface, wherein the exposed surface of the interconnect is not covered by the dielectric structure, and wherein a portion of the interconnect projects from the exterior surface of the dielectric structure.
A microfeature workpiece, comprising:
- a substrate having a first side and a second side opposite the first side;
- a microelectronic die formed in and/or on the substrate, the die including a terminal at the first side of the substrate and an integrated circuit operably coupled to the terminal;
- a hole extending through the terminal and the substrate;
- a dielectric structure on the second side of the substrate defining a plane;
- and
- an electrically conductive interconnect including a conductive fill material in the hole and a conductive layer in the hole between the conductive fill material and the substrate, both the conductive fill material and the conductive layer being electrically coupled to the terminal and extending from the terminal through the substrate and projecting from the substrate such that the conductive fill material and the conductive layer projects beyond the plane.
A microfeature workpiece, comprising:
- a substrate having a first side and a second side opposite the first side;
- a microelectronic die formed in and/or on the substrate, the die including a terminal at the first side of the substrate and an integrated circuit operably coupled to the terminal;
- a dielectric structure disposed on the second side of the substrate and having an exterior surface;
- and
- an electrically conductive interconnect including a conductive fill material in the hole and a conductive layer in the hole between the conductive fill material and the substrate, both the conductive fill material and the conductive layer being electrically coupled to the terminal and extending from the terminal through the substrate and projecting from the substrate and the exterior surface, wherein the conductive fill material is recessed relative to the conductive layer at the second side of the substrate.
Dependencies are inferred from the claim text.