Surface Protective Sheet
AssigneeLintec Corporation
InventorsKazuyuki Tamura, Shigeto Okuji
Life of this patent
Estimating the term…
Abstract
A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.
Claims6
A surface protective sheet used for a backside grinding of a semiconductor wafer formed with a circuit on a surface, wherein
- said surface protective sheet comprises an adhesive layer, and a base comprising a support film and an anti-static coat layer including an inorganic conductive filler and a cured product of a curable resin (A),
- a stress relaxation rate of the base after 1 minute of 10% stretch is 60% or more, and
- a Young's modulus of the base is 100 to 2000 MPa.
A production method of a surface protective sheet comprising steps of forming,
- a pre-cured layer by coating and pre-curing a compound including the curable resin (B),
- a coat layer by coating a compound including the inorganic conductive filler and the curable resin (A) on the pre-cured layer, and
- a base by curing the pre-cured layer and the coat layer.
A surface protective sheet for a backside grinding of a semiconductor wafer formed with a circuit on a surface, comprising:
- a base comprising a support film and an anti-static coat layer including an inorganic conductive filler and a cured product of a curable resin (A);
- and
- an adhesive layer,
- wherein a stress relaxation rate of the base after 1 minute of 10% stretch is 60% or more, and a Young's modulus of the base is 100 to 2000 MPa.
Dependencies are inferred from the claim text.