Wafer loading apparatus of wafer polishing equipment and method for adjusting wafer loading position

A wafer loading apparatus of wafer polishing equipment, comprising:

• a wafer polisher that includes a polishing carrier with a wafer hole in which a wafer is loaded and polishes both sides of the wafer using a top board and a bottom board;
• a wafer transferrer at which a plurality of transfer arms disposed at a top of the polishing carrier to transfer the wafer are longitudinally connected to one another and a transfer plate corresponding to a shape of the wafer is connected to one end of each of the transfer arms;
• a plurality of wafer position detectors installed at an edge of a bottom surface of the transfer plate to detect a position of each wafer hole;
• a plurality of wafer attachment/detachment units formed at an edge of the transfer plate;
• a wafer aligner installed at a top end surface of the transfer plate to align the wafer;
• and
• a controller to which data on the position of the wafer hole detected by the wafer position detector is transmitted and which calculates a position at which the wafer will be loaded by the wafer attachment/detachment units and the wafer aligner.

A method of adjusting a wafer loading position using a wafer loading apparatus of wafer polishing equipment, the method comprising:

• (a) an operation of detecting a position of a wafer hole formed in a polishing carrier;
• (b) a first loading operation of loading a wafer in the wafer hole;
• (c) an operation of confirming whether the wafer is loaded at a precise position of the wafer hole;
• (d) an operation of calculating a movement distance of the wafer to load the wafer at the precise position of the wafer hole;
• and
• (e) a second loading operation of loading the wafer at the precise position of the wafer hole by adjusting a position of the wafer as much as the movement distance and aligning the wafer.