Decapsulation System

A method for decapsulating comprising the steps:

• placing an encapsulated device or a printed circuit board including an encapsulated device on a gasket on an etch head supported substantially off-center on an etch plate, the etch head and gasket having an opening exposing the encapsulated device to a reaction region below the etch head;
• sealing a vertically-translatable cover to the etch plate with a toggle mechanism mounted to a metal plate to which the etch plate is mounted, the etch plate and cover forming an etching chamber over the etch head;
• urging the encapsulated device against the gasket by a ram mechanism operating sealed through the cover;
• continuously purging the etching chamber with a pressure-controlled source of Nitrogen or inert gas;
• delivering an etchant solution to the reaction region from a controlled pump drawing etchant solution in a preset ratio from one or more sources;
• heating or cooling the etchant solution in passages leading to the reaction region through a heat exchanger;
• removing used etchant solution from the reaction region through one or more waste passages.