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US 2017/0323809 A1Published application
Substrate washing device
AssigneeEbara Corporation
InventorsKoichi FUKAYA, Tomoatsu ISHIBASHI, Hisajiro NAKANO
Life of this patent
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Abstract
A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.
Claims10
A substrate washing device comprising:
- a substrate holding mechanism that holds a substrate;
- a substrate rotating mechanism that rotates the substrate held by the substrate holding mechanism;
- and
- a two-fluid nozzle that ejects a two-fluid jet toward a surface of the rotating substrate, wherein
- the two-fluid nozzle is formed of a conductive material.
2 more elements
A substrate washing device comprising:
- a substrate holding mechanism that holds a substrate;
- a substrate rotating mechanism that rotates the substrate held by the substrate holding mechanism;
- a two-fluid nozzle that ejects a two-fluid jet toward a surface of the rotating substrate;
- and
- a specific-resistance adjusting mechanism that adjusts the specific resistance value of a washing liquid to be supplied to the two-fluid nozzle.
2 more elements
Dependencies are inferred from the claim text.