Substrate processing system and substrate processing method
AssigneeKctech Co., Ltd.
InventorsYoung Kyu Kweon, Joon Ho An, Byoung Chaul Son, Jin Sung Rho
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Abstract
Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.
Claims27
A substrate processing system comprising:
- a polishing part performing a Chemical Mechanical Polishing (CMP) process on a substrate;
- a cleaning part for cleaning the substrate having undergone the polishing process;
- and
- a substrate transferring part for transferring the substrate to the cleaning part before the substrate is polished in the polishing part,
- wherein the substrate enters the polishing part after being preparatorily cleaned in the cleaning part prior to the polishing process.
Dependencies are inferred from the claim text.