Film, method for its production, and method for producing semiconductor element using the film

Abstract

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles MOH of hydroxy groups and the number of moles MCOOH of carboxy groups, derived from the acrylic polymer, and the number of moles MNCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

Dependencies are inferred from the claim text.