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US 2017/0323802 A1Published application
Semiconductor die assemblies with heat sink and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsWei Zhou, Zhaohui Ma, Aibin Yu
Life of this patent
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Abstract
Semiconductor die assemblies with heat sinks are disclosed herein. In one embodiment, a semiconductor die assembly includes a stack of semiconductor dies and a mold material surrounding at least a portion of the stack of semiconductor dies. A heat sink is disposed on the stack of semiconductor dies and adjacent the mold material. The heat sink includes an exposed surface and a plurality of heat transfer features along the exposed surface that are configured to increase an exposed surface area compared to a planar surface.
Claims20
A semiconductor die assembly, comprising:
- a stack of first semiconductor dies;
- a mold material having a portion extending beyond the stack of first semiconductor dies;
- and
- a heat sink including a second semiconductor die, wherein the second semiconductor die is positioned outwardly from the stack of first semiconductor dies, and wherein the second semiconductor die includes a plurality of heat transfer features having an outermost surface defined by a plurality of grooves configured to increase an exposed surface area of the second die compared to a planar surface.
1 more element
A semiconductor die assembly, comprising:
- a stack of first semiconductor dies, wherein the stack of first semiconductor dies has an outer side;
- a second semiconductor die attached to the stack of first semiconductor dies at the outer side, wherein the second semiconductor die includes
- a continuous outermost surface, and
- a plurality of heat transfer features formed along the continuous outermost surface and configured to increase an exposed surface area of the second semiconductor die compared to a planar surface;
- and
- a mold material at least partially surrounding the stack of first semiconductor dies and having a portion projecting beyond the outer side of the stack of first semiconductor dies.
3 more elements
Dependencies are inferred from the claim text.