Plasma treatment process for in-situ chamber cleaning efficiency enhancemnet in plasma processing chamber
AssigneeApplied Materials, Inc.
InventorsLin ZHANG, Xuesong LU, Andrew V. LE, Jang Seok OH, Xinhai HAN
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AssigneeApplied Materials, Inc.
InventorsLin ZHANG, Xuesong LU, Andrew V. LE, Jang Seok OH, Xinhai HAN
Estimating the term…
Embodiments of the disclosure include methods for in-situ chamber cleaning efficiency enhancement process for a plasma processing chamber utilized for a semiconductor substrate fabrication process. In one embodiment, a method for performing a plasma treatment process after cleaning a plasma process includes performing a cleaning process in a plasma processing chamber in absent of a substrate disposed thereon, subsequently supplying a plasma treatment gas mixture including at least a hydrogen containing gas and/or an oxygen containing gas into the plasma processing chamber, applying a RF source power to the processing chamber to form a plasma from the plasma treatment gas mixture, and plasma treating an interior surface of the processing chamber.
A method for performing a plasma treatment process after a plasma cleaning process, comprising:
(canceled)
A method for performing a plasma treatment process after a plasma cleaning process, comprising:
A method for performing a plasma treatment process after cleaning a plasma process, comprising:
Dependencies are inferred from the claim text.