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US 2017/0323682 A1Published application
Three-Dimensional Flash NOR Memory System With Configurable Pins
AssigneeSilicon Storage Technology, Inc.
InventorsHieu Van Tran, Hung Quoc Nguyen, Mark Reiten
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Abstract
A three-dimensional flash memory system is disclosed. The system comprises a memory array comprising a plurality of stacked dies, where each die comprises memory cells. The system further comprises a plurality of pins, where the function of at least some of the pins can be configured using a mechanism that selects a function for those pins from a plurality of possible functions.
Claims24
A three-dimensional memory system, comprising:
- a plurality of pins coupled to a logic circuit;
- and
- a memory array comprising a plurality of stacked dies, each die comprising memory cells;
- wherein the plurality of pins are configurable by the logic circuit to perform a function chosen from a plurality of functions, wherein one of the plurality of functions is accessing the memory array.
1 more element
A three-dimensional memory system, comprising:
- a plurality of pins coupled to a logic circuit;
- and
- a memory array comprising a plurality of stacked dies, each die comprising memory cells;
- wherein the plurality of pins are configurable by the logic circuit to perform a first function or a second function, wherein the first function is providing addresses to the memory array and the second function is accessing internal signals of the memory system.
1 more element
Dependencies are inferred from the claim text.