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US 2017/0323133 A1Published application
Device mountable packaging of ultrasonic transducers
AssigneeInvenSense, Inc.
InventorJulius Ming-Lin TSAI
Life of this patent
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Abstract
An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
Claims26
An electronic device comprising:
- an array of ultrasonic transducers for generating and receiving ultrasonic signals;
- and
- an acoustic coupling layer overlying the array of ultrasonic transducers, wherein the ultrasonic signals are propagated through the acoustic coupling layer.
An electronic device comprising:
- an array of ultrasonic transducers for generating and receiving ultrasonic signals;
- sidewalls bounding the array of ultrasonic transducers;
- an acoustic coupling layer overlying the array of ultrasonic transducers and bounded by the sidewalls, wherein the ultrasonic signals are propagated through the acoustic coupling layer, the acoustic coupling layer comprising an acoustic material supporting transmission of the ultrasonic signals;
- and
- a cover overlying the sidewalls and the acoustic coupling layer.
2 more elements
A mobile device comprising:
- a processor;
- a memory unit;
- a display device disposed on a first surface of the mobile device;
- and
- a fingerprint sensor disposed on a second surface of the mobile device, the fingerprint sensor comprising:
- an array of ultrasonic transducers for generating and receiving ultrasonic signals;
- and
- an acoustic coupling layer overlying the array of ultrasonic transducers, wherein the ultrasonic signals are propagated through the acoustic coupling layer.
5 more elements
Dependencies are inferred from the claim text.