Structure, electronic device including the same, and method of manufacturing structure

A method of manufacturing a structure comprising:

• a first step of preparing a first member and a second member, the second member including a first surface and a second surface which face opposite to each other and including a through hole which allows communication between a side of the first surface and a side of the second surface;
• a second step of inserting the first member in the through hole;
• a third step of injecting a sealant into a portion including the through hole after the second step;
• and
• a fourth step of sealing the through hole while the first member and the second member are fixed relatively to each other by curing the sealant injected in the third step,
• the second member including a space which opens into the second surface adjacently to the through hole on the side of the second surface,
• the first member including
• an extension portion which extends along the second surface on the side of the second surface of the second member, and
• a pass-through portion which passes through the space and the through hole,
• the space including
• a first region surrounded by the pass-through portion and the extension portion,
• a second region located opposite to the first region with the pass-through portion being interposed, and
• a third region which lies from one main surface of the pass-through portion to the other main surface of the pass-through portion while the third region is in contact with both of the first region and the second region,
• the extension portion including a hole which exposes a part of the first region,
• in the third step, the sealant being injected into the first region through the hole by applying a tip end of an instrument for injecting the sealant to the hole, and
• in the third step, the sealant injected into the first region being located to surround the pass-through portion as the sealant moves to the third region via the second region.