Liquid Crystal Device and Manufacturing Method Thereof

A method for manufacturing a liquid crystal device, comprising:

• forming an element layer over a top surface of a first substrate;
• providing a first temporary fixing substrate on a bottom surface of the first substrate with a slightly adhesive material provided therebetween;
• forming a first alignment film on the element layer;
• forming a base substrate to which the first temporary fixing substrate is bonded by performing first alignment treatment on the first alignment film;
• forming an electrode film on a top surface of a second substrate,
• providing a second temporary fixing substrate on a bottom surface of the second substrate with a slightly adhesive material provided therebetween;
• forming a second alignment film on the electrode film;
• forming a counter substrate to which the second temporary fixing substrate is bonded by performing second alignment treatment on the second alignment film;
• providing, over the base substrate,
• a first sealant;
• a liquid crystal material surrounded by the first sealant;
• a second sealant surrounding the first sealant;
• and
• a first conductive material over the element layer,
• bonding a surface where the second alignment film in the counter substrate is formed to a surface where the first alignment film in the base substrate is formed under reduced pressure;
• performing cure treatment on the first sealant, the second sealant, and the first conductive material;
• bonding the base substrate and the counter substrate using the first sealant, and the second sealant;
• connecting a part of the element layer and a part of the electrode film electrically using the first conductive material;
• separating the slightly adhesive material and the first temporary fixing substrate from the base substrate, and
• separating the slightly adhesive material and the second temporary fixing substrate from the counter substrate,
• wherein an external connection terminal is connected to a part of the element layer with a second conductive material interposed therebetween.

A method for manufacturing a liquid crystal device comprising:

• forming an element layer over a top surface of a first substrate whose value of fracture toughness is greater than or equal to 1.5 [MPa·m1/2];
• forming a base substrate by providing a first temporary fixing substrate on a bottom surface of the first substrate with a slightly adhesive material provided therebetween;
• forming an electrode film on a top surface of a second substrate whose value of fracture toughness is greater than or equal to 1.5 [MPa·m1/2];
• forming a counter substrate by providing a second temporary fixing substrate on a bottom surface of the second substrate with a slightly adhesive material interposed therebetween;
• and
• providing, over the base substrate,
• a first sealant;
• a liquid crystal material surrounded by the first sealant;
• a second sealant surrounding the first sealant;
• and
• a first conductive material over the element layer,
• bonding a surface where the electrode film in the counter substrate is formed to a surface where the element layer in the base substrate is formed under reduced pressure;
• performing cure treatment on the first sealant, the second sealant, and the first conductive material;
• bonding the base substrate and the counter substrate using the first sealant, and the second sealant;
• connecting a part of the element layer and a part of the electrode film electrically using the first conductive material;
• separating the slightly adhesive material and the first temporary fixing substrate from the base substrate, and
• separating the slightly adhesive material and the second temporary fixing substrate from the counter substrate,
• wherein an external connection terminal is connected to part of the element layer through a second conductive material.

A method for manufacturing a liquid crystal device comprising:

• forming a first electrode film on a top surface of a first substrate whose value of fracture toughness is greater than or equal to 1.5 [MPa·m1/2];
• providing a first temporary fixing substrate over a bottom surface of the first substrate with a slightly adhesive material interposed therebetween;
• forming a first alignment film over the first electrode film;
• forming a base substrate to which the first temporary fixing substrate is bonded by performing first alignment treatment on the first alignment film;
• forming a second electrode film on a top surface of a second substrate whose value of fracture toughness is greater than or equal to 1.5 [MPa·m1/2];
• providing a second temporary fixing substrate over a bottom surface of the second substrate with a slightly adhesive material interposed therebetween;
• forming a second alignment film over the second electrode film;
• forming a counter substrate to which the second temporary fixing substrate is bonded by performing second alignment treatment on the second alignment film;
• providing, over the base substrate,
• a first sealant;
• a liquid crystal material surrounded by the first sealant;
• a second sealant surrounding the first sealant;
• and
• a first conductive material over the element layer,
• bonding a surface where the second alignment film in the counter substrate is formed to a surface where the first alignment film in the base substrate is formed under reduced pressure;
• performing cure treatment on the first sealant, the second sealant, and the first conductive material;
• bonding the base substrate and the counter substrate using the first sealant, and the second sealant;
• connecting a part of the first electrode film and a part of the second electrode film electrically using the first conductive material;
• separating the slightly adhesive material and the first temporary fixing substrate from the base substrate, and
• separating the slightly adhesive material and the second temporary fixing substrate from the counter substrate,
• wherein an external connection terminal is connected to a part of the first electrode film or the second electrode film through a second conductive material.