Integrated electro-optical module assembly

A test structure comprising:

• a frame containing a plurality of openings and having a plurality of integrated probes located on a surface thereof;
• a flexible substrate comprising areas for forming electro-optical module assemblies, the flexible substrate containing integrated traces and pads for electrical testing located on a surface thereof, wherein the integrated probes and the integrated traces and pads are configured to contact each other upon contacting the frame with the flexible substrate, and wherein each opening in the frame is configured to expose one of the areas for forming one of the electro-optical module assemblies;
• and
• a light source located beneath the flexible substrate.

A method of forming a plurality of electro-optical module assemblies, the method comprising:

• providing a flexible substrate containing a first surface and a second surface opposite the first surface, the first surface including a plurality of electronic components located thereon;
• bringing a frame containing openings therein in direct contact with the first surface of the flexible substrate, wherein each opening of the frame physically exposes at least one of the electric components and an electro-optical module assembly area of the flexible substrate;
• forming an opening in an inner portion of each electro-optical module assembly area of the flexible substrate utilizing the frame as a mask;
• affixing an optical component to the second surface of the flexible substrate and within each electro-optical module assembly area of the flexible substrate, wherein each opening in the electro-optical module assembly area of the flexible substrate exposes a portion of one of the optical components;
• cutting outermost portions of each electro-optical module assembly area of the flexible substrate exposed by each opening in the frame to provide a plurality of pre-electro-optical module assemblies having the first and second surfaces;
• and
• forming at least one micro-energy source to the first surface of each pre-electro-optical module assembly.

A method of forming a plurality of electro-optical module assemblies, the method comprising:

• providing a flexible substrate containing a first surface and a second surface opposite the first surface, the first surface including a plurality of electronic components located thereon;
• bringing a frame containing openings therein in direct contact with the first surface of the flexible substrate, wherein each opening of the frame physically exposes at least one of the electric components and an electro-optical module assembly area of the flexible substrate;
• forming an opening in an inner portion of each electro-optical module assembly area of the flexible substrate utilizing the frame as a mask;
• affixing an optical component to the second surface of the flexible substrate and within each electro-optical module assembly area of the flexible substrate, wherein each opening in the electro-optical module assembly area of the flexible substrate exposes a portion of one of the optical components;
• forming at least one micro-energy source within the electro-optical module assembly area and on the first surface of the flexible substrate;
• and
• cutting outermost exposed portions of each electro-optical module assembly area of the flexible substrate exposed by each opening in the frame to provide the electro-optical module assemblies.