High performance thermal interface materials with low thermal impedance
AssigneeHoneywell International Inc.
InventorsLiqiang Zhang, Ling Shen, Hui Wang, Ya Qun Liu, Wei Jun Wang, Hong Min Huang
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Abstract
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Claims21
1-10. (canceled)
A thermal interface material comprising:
- at least one polymer;
- at least one phase change material
- a first thermally conductive filler having a first particle size;
- and
- a second thermally conductive filler having a second particle size;
- wherein the first particle size is larger than the second particle size.
A formulation for forming a thermal interface material comprising:
- at least one solvent;
- at least one polymer;
- at least one phase change material
- a first thermally conductive filler having a first particle size;
- and
- a second thermally conductive filler having a second particle size;
- wherein the first particle size is larger than the second particle size.
An electronic component comprising:
- a heat sink;
- an electronic chip;
- a thermal interface material positioned between the heat sink and electronic chip, the thermal interface material including:
- at least one polymer;
- at least one phase change material
- a first thermally conductive filler having a first particle size;
- and
- a second thermally conductive filler having a second particle size;
- wherein the first particle size is larger than the second particle size.
Dependencies are inferred from the claim text.