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US 2017/0321098 A1Published application
Polishing Composition
AssigneeFujimi Incorporated
InventorsShuhei TAKAHASHI, Masatoshi TOMATSU
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Abstract
The present invention provides a polishing composition for use in polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing composition has an oxidation-reduction potential ORPx mV and the material to be polishing has an oxidation-reduction potential ORPy mV, with their relation satisfying ORPx−ORPy≧100 mV.
Claims15
A polishing composition for polishing a material having a Vickers hardness of 1500 Hv or higher, wherein
- the polishing composition has an oxidation-reduction potential ORPx mV and the material to be polished has an oxidation-reduction potential ORPy mV, their relation satisfying the following formula (1):
- ORPx−ORPy≧100 mV (1)
A method of polishing a material having a Vickers hardness of 1500 Hv or higher, the method comprising:
- (a) obtaining a polishing composition;
- (b) preparing a polishing slurry from the polishing composition;
- and
- (c) supplying the polishing slurry to a surface of the material,
- wherein the polishing composition has an oxidation-reduction potential ORPx mV and the material to be polished has an oxidation-reduction potential ORPy mV, their relation satisfying the following formula (1):
- ORPx−ORPy≧100 mV (1)
3 more elements
Dependencies are inferred from the claim text.