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US 2017/0321096 A1Published application
Surface Mounting Using Partially Cured B Staged and Fully Cured C Staged Thermoplastic Polyimide TPI Adhesive Compounds
AssigneeFraivillig Technologies Company
InventorJames B. Fraivillig
Life of this patent
Estimating the term…
Abstract
A process utilizing thermoplastic adhesives for surface mounting or laminating two or more substrate surfaces consisting of a combination of thermoplastic-polyimide (TPI) adhesive layers, one of which is B-staged or partially cured, and the other of which is C-Staged or fully cured, employed both as direct coatings and/or stand alone bondfilms, as well as their advantageous use in joining materials of mismatched Coefficients of Thermal Expansion (CTE).
Claims10
A method for preparing a laminate by bonding two surfaces utilizing heat activated thermoplastic adhesive, said method comprising in combination:
- A. providing a first surface to be bonded ;
- B. providing a first liquid solution comprising a less than fully cured thermoplastic polyimide adhesive precursor polyamic acid polymer disposed in a solvent;
- C. coating a layer of said first solution upon said first surface;
- D. fully curing said first solution to a first layer of thermoplastic polyimide adhesive;
- E. providing a second surface to be bonded ;
- F. providing a second liquid solution comprising a less than fully cured thermoplastic polyimide adhesive precursor polyamic acid polymer disposed in a solvent;
- G. coating a layer of said second solution upon said second surface or said first layer of thermoplastic polyimide;
- H. partially curing said second liquid solution to a layer of thermoplastic polyimide adhesive comprising in combination:
- a mixture of polyamic acid polymer and thermoplastic polyimide polymer solids disposed in said solvent, said mixture containing no less than 10% and no greater than 50% thermoplastic polyimide of the total polymer mass and said mixture further containing an amount of solvent of between 20 and 60% of the total mass of the mixture;
- I. positioning the fully cured adhesive side of said first surface in contact with the partially cured adhesive side of said second surface or said first layer of thermoplastic polyimide to form an unbonded laminate;
- and
- J. applying heat and pressure to said unbonded laminate to:
- i. outgas said solvent from said adhesive bondline;
- ii. substantially convert all of said polyamic-acid polymer to said thermoplastic polyimide polymer, said conversion generating a quantity of water vapor;
- iii. outgas said water vapor from said adhesive bondline;
- and
- iv. bond said surfaces at the completion of said outgassing.
14 more elements
A method for preparing a laminate by bonding two surfaces utilizing a heat activated thermoplastic adhesive coated bondfilm, said method comprising in combination:
- A. providing a substrate having first and second substrate surfaces;
- B. providing a first liquid solution comprising a less than fully cured thermoplastic polyimide adhesive precursor polyamic acid polymer disposed in a solvent;
- C. coating a layer of said first solution upon said first substrate surface;
- D. fully curing said first solution to a layer of thermoplastic polyimide adhesive;
- E. providing a second liquid solution a less than fully cured thermoplastic polyimide adhesive precursor polyamic acid polymer disposed in a solvent;
- F. coating a layer of said second solution upon said second substrate surface;
- G. partially curing said second liquid solution to a layer of thermoplastic polyimide adhesive comprising in combination:
- a mixture of polyamic acid polymer and thermoplastic polyimide polymer solids disposed in said solvent, said mixture containing no less than 10% and no greater than 50% thermoplastic polyimide of the total polymer mass and said mixture further containing an amount of solvent of between 20 and 60% of the total mass of the mixture;
- said coated substrate comprising said bondfilm;
- H. providing a first laminate surface to be bonded;
- I. providing a second laminate surface to be bonded;
- J. disposing said bondfilm between said first and second laminate surfaces to form an unbounded laminate;
- and
- K. applying heat and pressure to said unbonded laminate to:
- i. outgas said solvent from said adhesive bondline;
- ii. substantially convert all of said polyamic-acid polymer to said thermoplastic polyimide polymer, said conversion generating a quantity of water vapor;
- iii. outgas said water vapor from said adhesive bondline;
- and
- iv. bond said surfaces at the completion of said outgassing.
16 more elements
Dependencies are inferred from the claim text.