Aqueous conductive coating
AssigneeLord Corporation
InventorsTimothy R. FORNES, Richard E. HEINZE
Life of this patent
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Abstract
An aqueous composition is provided comprising a resin, a curative, a filler, a surfactant, and water; wherein the resin comprises an average molecular weight of less than about 800 Daltons and comprises at least 50 weight percent of at least one of: (a) an unmodified epoxy or phenoxy resin, or (b) a surfactant-modified epoxy or phenoxy resin. This composition, applied to a substrate and dried, can then be cured so as to thermoset the resin and self-assemble to form continuous pathways of filler within the resin matrix.
Claims21
An aqueous composition comprising a resin, a curative, a filler, a surfactant, and water;
- wherein the resin comprises an average molecular weight of less than about 800 Daltons and comprises at least 50 weight percent of at least one of:
- (a) an unmodified epoxy or phenoxy resin, or (b) a surfactant-modified epoxy or phenoxy resin.
A method for coating a substrate comprising:
- a) Mixing together a resin, a curative, a filler, a surfactant, and water;
- wherein the resin comprises an average molecular weight of less than about 800 Daltons and comprises at least 50 weight percent of at least one of:
- (a) an unmodified epoxy or phenoxy resin, or (b) a surfactant-modified epoxy or phenoxy resin, to provide a homogenously mixed coating composition;
- b) applying the coating composition to a substrate;
- c) drying the composition to remove substantially all the water;
- and
- d) curing the coating composition.
Dependencies are inferred from the claim text.