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US 2017/0321079 A1Published application
Polymer compound, surface treatment agent, laminated body using surface treatment agent, transistor, method for manufacturing laminated body
AssigneeNikon Corporation
InventorsYusuke KAWAKAMI, Shohei Koizumi, Takashi Sugizaki
Life of this patent
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Abstract
Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]
Claims11
A polymer compound comprising a constituent unit represented by the following formula (1).
- [in the formula (1), R1 represents hydrogen or a methyl group, m represents an integer of 2 to 20, and Q represents a photosensitive leaving group]
Dependencies are inferred from the claim text.