Polyimide, resin film, and metal-clad laminate
AssigneeNippon Steel & Sumikin Chemical Co., Ltd.
InventorsAkira MORI, Aiko HARA, Eigo KONDO, Tomonori ANDO
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AssigneeNippon Steel & Sumikin Chemical Co., Ltd.
InventorsAkira MORI, Aiko HARA, Eigo KONDO, Tomonori ANDO
Estimating the term…
A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10−6 to 30×10−6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.
A resin film having one or a plurality of polyimide layers, wherein
A metal-clad laminate comprising an insulating resin layer and a metal layer, wherein
A polyimide obtained by reacting an anhydride component comprising an aromatic tetracarboxylic anhydride with a diamine component comprising an aromatic diamine, wherein
Dependencies are inferred from the claim text.