Microelectromechanical system structure and method for fabricating the same

A method for fabricating a microelectromechanical system (MEMS) structure, comprising:

• providing a first substrate, wherein a transistor, a first dielectric layer and an interconnection structure are formed thereon, the transistor is disposed on the first substrate, the first dielectric layer is disposed on the first substrate and covering the transistor, and the interconnection structure is disposed within the first dielectric layer and electrically connected to the transistor;
• providing a second substrate, wherein a second dielectric layer and a thermal stability layer are formed on the second substrate, the second dielectric layer is disposed on the second substrate, and the thermal stability layer is located within the second dielectric layer;
• bonding the first substrate to the second substrate;
• removing the second substrate;
• and
• forming a conductive layer within the second dielectric layer, wherein the conductive layer is electrically connected to the interconnection structure,
• wherein the thermal stability layer is located between the conductive layer and the interconnection structure, and
• wherein a growth temperature of a material of the thermal stability layer is higher than a growth temperature of a material of the conductive layer and a growth temperature of a material of the interconnection structure.