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US 2017/0320726 A1Published application
MEMS Package
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMarkus Leitgeb, Nick Renaud-Bezot
Life of this patent
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Abstract
A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.
Claims21
A package comprising:
- a base structure, which has an electrically isolating material and/or an electrically conductive contact structure;
- an electronic component, which is embedded in the base structure or is arranged on the base structure;
- a microelectromechanical system (MEMS) component;
- and
- a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.
2 more elements
(canceled)
A method for manufacturing packages, the method comprising:
- embedding an electronic component in, or arranging the electronic component on a base structure, which has an electrically isolating material and/or an electrically conductive contact structure;
- mounting a microelectromechanical system (MEMS) component at the base structure;
- and
- at least partially covering the MEMS component with a cover structure, which is mounted at the base structure.
1 more element
An assembly, comprising:
- a base master structure, which has an electrically isolating material and/or an electrically conductive contact structure;
- a plurality of electronic components, which are embedded in the base master structure, or are arranged on the base master structure;
- a plurality of MEMS components at the base master structure;
- a cover master structure, which is mounted at the base master structure and at least partially covers the MEMS components, in order to thus define individual cavities for each one of the MEMS components between a respective section of the base master structure and a respective section of the cover master structure.
1 more element
Dependencies are inferred from the claim text.