Low stress integrated device packages
AssigneeAnalog Devices, Inc.
InventorThomas M. Goida
Life of this patent
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Abstract
An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.
Claims30
An integrated device package comprising:
- a packaging structure defining a cavity;
- an integrated device die disposed at least partially within the cavity;
- and
- a gel within the cavity, the gel surrounding the integrated device die.
An integrated device package comprising:
- a carrier;
- a filler material over a top surface of the carrier;
- and
- an integrated device die embedded or disposed within the filler material such that at least a portion of the filler material is disposed under an entire bottom surface of the integrated device die between the bottom surface of the integrated device die and the top surface of the carrier.
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An integrated device package comprising:
- a carrier;
- a packaging structure defining a gas cavity;
- and
- an integrated device die disposed within the gas cavity, the integrated device die at least partially supported above the carrier by a bonding wire such that a gap is disposed between at least a portion of the integrated device die and the carrier.
Dependencies are inferred from the claim text.