Determining an automatic bonding sequence for optical bonding

A computer system, comprising:

• a processor;
• a memory device coupled to the processor;
• and
• a computer readable storage device coupled to the processor, wherein the storage device contains program code executable by the processor via the memory device to implement a method customizing an automated bonding sequence, the method comprising:
• detecting, by a processor of a computing system, that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate;
• stopping, by the processor, an automated process of optically bonding of the optical bonding operation, in response to the detecting;
• recording, by the processor, operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate;
• analyzing, by the processor, the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate;
• and
• resuming, by the processor, the automated process of the optical bonding operation.

A computer program product, comprising a computer readable hardware storage device storing a computer readable program code, the computer readable program code comprising an algorithm that when executed by a computer processor of a computing system implements a method customizing an automated bonding sequence, the method comprising:

• detecting, by a processor of a computing system, that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate;
• stopping, by the processor, an automated process of optically bonding of the optical bonding operation, in response to the detecting;
• recording, by the processor, operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate;
• analyzing, by the processor, the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate;
• and
• resuming, by the processor, the automated process of the optical bonding operation.