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US 2017/0320240 A1Published application
Embossing dies having polymer layers
AssigneeHewlett-Packard Indigo B.V.
InventorIlan MEIRI
Life of this patent
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Abstract
Provided is a method of manufacturing an embossing die. The method comprises mounting a drum or a plate on a support, providing information on a shape of the embossing die, printing a multitude of photopolymer drops forming a photopolymer layer upon the drum or the plate based on the provided information, and curing the printed photopolymer layer.
Claims15
An embossing apparatus, comprising:
- a first die having a first body on which an embossing shape is foliated by a first polymer layer adhering to a surface of the first body, a second die having a second body on which a background is formed by a second polymer layer adhering to a surface of the second body;
- and
- a feeder to guide a substrate between the first die and the second die.
An embossing drum manufacturing apparatus, comprising:
- a rotatable support to mount a drum thereon;
- and
- an ink-jet print head to print a curable polymer layer directly upon the drum.
An embossing plate manufacturing apparatus, comprising:
- a support to mount a plate thereon;
- and
- an ink jet print head to print a curable polymer layer upon the plate.
A method of manufacturing an embossing die comprising:
- mounting a drum or a plate on a support;
- providing information on a shape of the embossing die;
- printing a multitude of photopolymer drops forming a photopolymer layer upon the drum or the plate based on the provided information;
- and
- curing the printed photopolymer layer.
2 more elements
Dependencies are inferred from the claim text.