Back to results
US 2017/0320189 A1Published application
Chemical mechanical polishing apparatus
AssigneeYtdiamond Co., Ltd.
InventorYING-TUNG CHEN
Life of this patent
Estimating the term…
Abstract
The present disclosure discloses a chemical mechanical polishing apparatus including a polishing machine platform, an electrode film, a polishing pad and a wafer carrier. The electrode film has a first single electrode structure and is disposed on the polishing machine platform. The polishing pad is disposed on the electrode film. The wafer carrier is disposed on the polishing machine platform. In particular, the first single electrode structure generates a first homopolar electric field on the polishing pad.
Claims17
A chemical mechanical polishing apparatus, comprising:
- a polishing machine platform;
- an electrode film having a first single electrode structure and being disposed on the polishing machine platform;
- a polishing pad disposed on the electrode film;
- and
- a wafer carrier disposed on the polishing machine platform;
- wherein the first single electrode structure generates a first homopolar electric field on the polishing pad.
3 more elements
A chemical mechanical polishing apparatus, comprising:
- a polishing machine platform;
- a polishing pad disposed on the electrode film;
- a wafer carrier disposed on the polishing machine platform and having a mounting surface for mounting a wafer;
- and
- an electrode film having a first single electrode structure and being disposed on the mounting surface of the wafer carrier;
- wherein the first single electrode structure generates a first homopolar electric field on the polishing pad.
3 more elements
Dependencies are inferred from the claim text.