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US 2017/0320188 A1Published application
Substrate processing system
AssigneeKctech Co., Ltd.
InventorsYoung Kyu Kweon, Byoung Chaul Son, Moon Gi Cho, Joon Ho An
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Abstract
A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.
Claims37
A substrate processing system comprising:
- a polishing part performing a Chemical Mechanical Polishing (CMP) process on a substrate;
- a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
- and
- a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.
1 more element
Dependencies are inferred from the claim text.