Method for Forming Solder Deposits
AssigneePac Tech—Packaging Technologies GmbH
InventorGhassem Azdasht
Life of this patent
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Abstract
A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
Claims8
Method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component, in which wetting surfaces of the contact metallizations are brought into physical contact with a solder material layer arranged on a solder material carrier,
- at least for the duration of the physical contact a heating of the substrate and a tempering of the solder material layer takes place,
- and subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
Dependencies are inferred from the claim text.